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Title:
ENCAPSULATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/014374
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an encapsulation method which uses a cover film that exhibits high safety and high encapsulation performance.　An encapsulation method according to the present invention is carried out with use of an encapsulation solvent and a cover film that is obtained by providing an adhesive polymer layer on a transparent support; the encapsulation solvent contains an ester compound; and the ester compound has a boiling point of from 80°C to 170°C.

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Inventors:
UMEHARA TAKESHI (JP)
MITSUI TETSURO (JP)
SASAHARA KANA (JP)
HARA MIYOKO (JP)
TAMURA AKIO (JP)
INUSHIMA REIKO (JP)
Application Number:
PCT/JP2021/025134
Publication Date:
January 20, 2022
Filing Date:
July 02, 2021
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C09J11/06; C09J7/20; C09J7/25; C09J7/30; C09J133/04; C09J201/00; G01N1/28; G02B21/34
Foreign References:
JPH11101943A1999-04-13
JPH1054942A1998-02-24
JPS6238408A1987-02-19
JPS61254916A1986-11-12
JP2004506228A2004-02-26
US20180194913A12018-07-12
JP2009514025A2009-04-02
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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