Title:
FILM FORMING DEVICE AND FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/116599
Kind Code:
A1
Abstract:
This film forming device comprises: a first vapor deposition means for releasing a vapor deposition material onto a substrate; a movement means for, during release of the vapor deposition material onto the substrate, causing the first vapor deposition means to move along a circular trajectory with respect to an axis; and a first monitoring means for monitoring the state of the release of the vapor deposition material onto the substrate.
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Inventors:
AONUMA DAISUKE (JP)
YASUKAWA HIDEHIRO (JP)
ICHIHARA MASAHIRO (JP)
NAGAOKA KEN (JP)
YASUKAWA HIDEHIRO (JP)
ICHIHARA MASAHIRO (JP)
NAGAOKA KEN (JP)
Application Number:
PCT/JP2023/036380
Publication Date:
June 06, 2024
Filing Date:
October 05, 2023
Export Citation:
Assignee:
CANON TOKKI CORP (JP)
International Classes:
C23C14/24
Foreign References:
| JP2014198861A | 2014-10-23 | |||
| JP2020164920A | 2020-10-08 | |||
| JP2015209559A | 2015-11-24 | |||
| JP2010196082A | 2010-09-09 |
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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