Title:
HEAT-DISSIPATING MEMBER AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2013/051246
Kind Code:
A1
Abstract:
The present invention provides a heat-dissipating member which is produced using a fluororesin and a heat-conductive filler and has good adhesion properties. The present invention is a heat-dissipating member which comprises a porous matrix comprising a fluororesin and a heat-conductive filler and an adhesive material contained in pores of the porous matrix, wherein the fluororesin comprises polytetrafluoroethylene.
Inventors:
TAGAWA KENICHI (JP)
TAKAYAMA YOSHINARI (JP)
KITAGAWA DAISUKE (JP)
TAKAYAMA YOSHINARI (JP)
KITAGAWA DAISUKE (JP)
Application Number:
PCT/JP2012/006325
Publication Date:
April 11, 2013
Filing Date:
October 03, 2012
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08J9/26; C08J9/14; C08K3/00; C08L27/18
Foreign References:
| JP2010137562A | 2010-06-24 | |||
| JP2004168867A | 2004-06-17 | |||
| JP2008208159A | 2008-09-11 |
Other References:
See also references of EP 2765157A4
Attorney, Agent or Firm:
KAMADA, Koichi et al. (JP)
Koichi Kamata (JP)
Koichi Kamata (JP)
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Claims: