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Title:
HEAT DISSIPATION APPARATUS AND VEHICLE-MOUNTED MODULE
Document Type and Number:
WIPO Patent Application WO/2022/242510
Kind Code:
A1
Abstract:
Provided in the embodiments of the present application are a heat dissipation apparatus and a vehicle-mounted module, the heat dissipation apparatus comprising a radiator outer shell, a main circuit board, an adapter circuit board, and a chip; the radiator outer shell comprises an upper shell and a lower shell, the upper shell and the lower shell being in sealed connection, the main circuit board being fixed in the upper shell, the main circuit board and a main heat dissipation plate of the upper shell being arranged opposite to one another, the chip being fixed on the adapter circuit board, the adapter circuit board being electrically connected to the main circuit board by means of a flexible conductive member, the adapter circuit board being connected to the main circuit board or the main heat dissipation plate by means of an elastic support member, the elastic support member being used for pressing the adapter circuit board to make the chip closely fit the main heat dissipation plate of the upper shell, a thermal conduction layer being filled between the chip and the upper shell, and the heat conduction layer being used for reducing the contact thermal resistance between the chip and the upper shell. Provided in the embodiments of the present application are a heat dissipation apparatus and a vehicle-mounted module capable of increasing the heat dissipation efficiency of a high power consumption device.

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Inventors:
PENG YAOFENG (CN)
Application Number:
PCT/CN2022/092032
Publication Date:
November 24, 2022
Filing Date:
May 10, 2022
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20
Domestic Patent References:
WO2007055625A12007-05-18
Foreign References:
CN107396617A2017-11-24
CN209845432U2019-12-24
CN212851558U2021-03-30
US5289337A1994-02-22
CN202110542232A2021-05-18
CN202111335609A2021-11-11
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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