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Title:
LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF LIGHT EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/130544
Kind Code:
A1
Abstract:
In order to be more compact and thin, this light emitting device (1) comprises LED elements (3-6) embedded in a resin molded body (2) such that light emitting units (32-62) face the front surface (21) of the resin molded body (2) and positive electrodes (33-63) and negative electrodes (34-64) are exposed on the back surface (23) of the resin molded body (2).

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Inventors:
KAWAI WAKAHIRO (JP)
Application Number:
PCT/JP2016/084781
Publication Date:
August 03, 2017
Filing Date:
November 24, 2016
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01L33/54; B29C45/14; H01L33/60; H01L33/62; H01L33/64
Domestic Patent References:
WO2014064871A12014-05-01
WO2014100652A12014-06-26
Foreign References:
JP2015207703A2015-11-19
JP2012099545A2012-05-24
JP2015177005A2015-10-05
JPS6425582A1989-01-27
JPH11219961A1999-08-10
JP2008016297A2008-01-24
JPH05150807A1993-06-18
JPH09179512A1997-07-11
Other References:
See also references of EP 3410499A4
Attorney, Agent or Firm:
MURAKAMI, Takashi (JP)
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