Title:
LIGHT-RECEIVING ELEMENT, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/014364
Kind Code:
A1
Abstract:
The present technology relates to a light-receiving element, a method for manufacturing the same, and an electronic apparatus with which it is possible to obtain high quantum efficiency with respect to infrared light and increased sensitivity. The light-receiving element has a pixel array region formed in a first semiconductor substrate and in which pixels each having a photoelectric conversion region are arrayed in a matrix, the photoelectric conversion region of each pixel being formed of an SiGe region or a Ge region. The present technology may be applied to, for example, a ranging module for measuring the distance to a subject.
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Inventors:
SATO MASATAKA (JP)
Application Number:
PCT/JP2021/025083
Publication Date:
January 20, 2022
Filing Date:
July 02, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L31/107; H01L27/144; H01L27/146; H04N5/369
Domestic Patent References:
| WO2020022349A1 | 2020-01-30 | |||
| WO2017212977A1 | 2017-12-14 | |||
| WO2020017339A1 | 2020-01-23 | |||
| WO2018174090A1 | 2018-09-27 |
Foreign References:
| JP2020517114A | 2020-06-11 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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