METHOD OF HEAT−PEELING CHIP CUT PIECES FROM HEAT PEEL TYPE ADHESIVE SHEET, ELECTRONIC PART, AND CIRCUIT BOARD

Title:

METHOD OF HEAT−PEELING CHIP CUT PIECES FROM HEAT PEEL TYPE ADHESIVE SHEET, ELECTRONIC PART, AND CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2003/012858

Kind Code:

A1

Abstract:

A method of heat peeling chip cut pieces (3a) from a heat peel type adhesive sheet (2) is a method by which chip cut pieces (3a) stuck to the heat peel type adhesive sheet (2) provided with a thermally expansible adhesive layer (2b) containing thermally expansible fine particles on one side of a substrate (2a) are peeled by heat from the heat peel type adhesive sheet (2), the method being characterized in that the heat peel type adhesive sheet (2) is heated in a restrained state and the chip cut pieces (3a) are peeled, wherein the means for restraining the heat peel type adhesive sheet (2) may be a suction means using suction or a adhesive means using an adhesive agent. Thereby, it is possible to heat−peel the chip cut pieces (3a) from the heat peel type adhesive sheet (2) while preventing horizontal positional shift.

Inventors:

MURATA AKIHISA (JP)
OOSHIMA TOSHIYUKI (JP)
ARIMITSU YUKIO (JP)
KIUCHI KAZUYUKI (JP)
SATOU MASAAKI (JP)
KAWANISHI MICHIROU (JP)

Application Number:

PCT/JP2002/007442

Publication Date:

February 13, 2003

Filing Date:

July 23, 2002

Export Citation:

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Assignee:

NITTO DENKO CORP (JP)
MURATA AKIHISA (JP)
OOSHIMA TOSHIYUKI (JP)
ARIMITSU YUKIO (JP)
KIUCHI KAZUYUKI (JP)
SATOU MASAAKI (JP)
KAWANISHI MICHIROU (JP)

International Classes:

C09J7/22; C09J7/38; C09J201/00; H01L21/301; H01L21/67; H01L21/68; (IPC1-7): H01L21/68; H01L21/301; C09J7/02; C09J201/00

Foreign References:

JPH0745645A	1995-02-14
JPH111671A	1999-01-06
JPH06151585A	1994-05-31

Other References: