Title:
METHOD FOR HERMETICALLY ENCAPSULATING A COMPONENT
Document Type and Number:
WIPO Patent Application WO2003012856
Kind Code:
A3
Abstract:
The invention relates to a method for hermetically encapsulating a component (1) that is mounted in flip-chip design on a support (4). The inventive method is characterized by first covering the component with a film (8) that closely rests on the component and the support, then structuring the film, and providing thereon a hermetically sealing layer (14), especially a metal layer, which seals up with the support.
Inventors:
STELZL ALOIS (DE)
KRUEGER HANS (DE)
FEIERTAG GREGOR (DE)
CHRISTL ERNST (DE)
KRUEGER HANS (DE)
FEIERTAG GREGOR (DE)
CHRISTL ERNST (DE)
Application Number:
PCT/DE2002/002188
Publication Date:
September 25, 2003
Filing Date:
June 14, 2002
Export Citation:
Assignee:
EPCOS AG (DE)
STELZL ALOIS (DE)
KRUEGER HANS (DE)
FEIERTAG GREGOR (DE)
CHRISTL ERNST (DE)
STELZL ALOIS (DE)
KRUEGER HANS (DE)
FEIERTAG GREGOR (DE)
CHRISTL ERNST (DE)
International Classes:
H01L21/50; H01L21/56; H01L21/60; H01L23/10; H01L23/552; H01L23/28; (IPC1-7): H01L21/50; H01L23/10; H01L21/56; H03H9/10; H01L23/31; H01L31/0203
Foreign References:
| EP1093159A1 | 2001-04-18 | |||
| US20010009277A1 | 2001-07-26 | |||
| DE3138743A1 | 1983-04-07 | |||
| DE19816309A1 | 1998-12-24 | |||
| EP0967647A2 | 1999-12-29 | |||
| EP1091406A2 | 2001-04-11 | |||
| US5439849A | 1995-08-08 |
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