Title:
PACKAGE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/097564
Kind Code:
A1
Abstract:
This package has a base plate (10), a frame body (100), and lead frames (20A, 20B). The base plate (10) is composed of a metal, and has: a mounting area (11) to which a semiconductor element (300) is to be mounted; and a frame area (12) which encloses the mounting area (11). The frame body (100) is disposed on the frame area (12) of the base plate (10) so as to have a first surface (S1) that faces the frame area (12) and a second surface (S2) that is located on the side opposite to the first surface (S1). The lead frames (20A, 20B) are bonded to the second surface (S2) of the frame body (100). The frame body (100) includes: a plurality of dielectric layers (110) having a laminate structure; and element connection parts (121A, 121B) which are to be electrically connected to the semiconductor element (300). The plurality of dielectric layers (110) include: a first dielectric layer having a first electric permittivity; and a second dielectric layer having a second electric permittivity that is different from the first electric permittivity.
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Inventors:
WAKAZONO YOSHITSUGU (JP)
Application Number:
PCT/JP2017/040854
Publication Date:
May 23, 2019
Filing Date:
November 14, 2017
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L23/08; H01L23/04; H01L23/12
Foreign References:
| JP2004311568A | 2004-11-04 | |||
| JP2014107398A | 2014-06-09 | |||
| JPS63257255A | 1988-10-25 | |||
| JP2000312103A | 2000-11-07 | |||
| JP2014107398A | 2014-06-09 |
Other References:
See also references of EP 3712932A4
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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