Title:
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
Document Type and Number:
WIPO Patent Application WO/1998/050950
Kind Code:
A1
Abstract:
Bump electrodes which are the outer connection terminals of a package are made of elastic material. The stress which is produced by the difference in thermal expansion coefficient between the package and a printed wiring board on which the package is mounted is absorbed by the elastic deformation of the bump electrodes. The preferable elasticity of the elastic material of which the bump electrodes are made is 0.00001 Gpa to 5 Gpa and, more preferably, 0.001 Gpa to 1 Gpa.
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Inventors:
ICHITANI MASAHIRO (JP)
HARUTA RYO (JP)
YAMAGUCHI TOSHIHIRO (JP)
KIMOTO RYOSUKE (JP)
SHIBAMOTO MASANORI (JP)
HARUTA RYO (JP)
YAMAGUCHI TOSHIHIRO (JP)
KIMOTO RYOSUKE (JP)
SHIBAMOTO MASANORI (JP)
Application Number:
PCT/JP1997/001537
Publication Date:
November 12, 1998
Filing Date:
May 07, 1997
Export Citation:
Assignee:
HITACHI LTD (JP)
HITACHI MICROCOMPUTER SYST (JP)
ICHITANI MASAHIRO (JP)
HARUTA RYO (JP)
YAMAGUCHI TOSHIHIRO (JP)
KIMOTO RYOSUKE (JP)
SHIBAMOTO MASANORI (JP)
HITACHI MICROCOMPUTER SYST (JP)
ICHITANI MASAHIRO (JP)
HARUTA RYO (JP)
YAMAGUCHI TOSHIHIRO (JP)
KIMOTO RYOSUKE (JP)
SHIBAMOTO MASANORI (JP)
International Classes:
H01L23/498; H05K3/34; (IPC1-7): H01L21/60; H01L23/12
Foreign References:
| JPH0878574A | 1996-03-22 | |||
| JPH0574857A | 1993-03-26 | |||
| JPH05275489A | 1993-10-22 | |||
| JPH07118549A | 1995-05-09 | |||
| JPH01132138A | 1989-05-24 |
Attorney, Agent or Firm:
Tsutsui, Yamato (N.S. Excel 301 22-45, Nishishinjuku 7-chom, Shinjuku-ku Tokyo 160, JP)
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