Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003243560
Kind Code:
A
Abstract:
To provide a semiconductor device having a high heating value in which heat dissipation properties are improved.
The semiconductor device comprises a substrate (109) for mounting a semiconductor chip and solder balls, first holes (211) for mounting solder balls formed in the side of the substrate for mounting the solder balls (111), second conduction holes (311) smaller than the first holes formed in the side of the substrate opposite to the ball mounting side, and a wiring layer composed of an insulating film (108) formed entirely on the substrate and wirings (107, 108) of conductive metals formed on the insulating film wherein the first and second holes penetrate the substrate.
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Inventors:
KIMURA NAOTO
Application Number:
JP2002035400A
Publication Date:
August 29, 2003
Filing Date:
February 13, 2002
Export Citation:
Assignee:
KYUSHU NIPPON ELECTRIC
International Classes:
H01L23/12; H01L23/36; H01L23/498; H05K1/11; H05K3/34; H05K3/44; (IPC1-7): H01L23/12; H01L23/36
Attorney, Agent or Firm:
Masahiko Desk (2 outside)
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