Title:
WIRING DESIGN METHOD, WIRING STRUCTURE, AND FLIP CHIP
Document Type and Number:
WIPO Patent Application WO/2022/028100
Kind Code:
A1
Abstract:
The present disclosure provides a wiring design method and a wiring structure for a package substrate in a flip chip, and a flip chip. The wiring design method comprises: arranging bump pads into an array in rows and columns, the bump pads being used for bonding with conductive bumps on a flip wafer, and the bump pads comprising signal pads and non-signal pads; providing vias for the non-signal pads; and using a layer of wiring to lead out a subset of the signal pads outside an orthographic projection area of the flip wafer on the package substrate, the subset of the signal pads being used for bearing all functional signals required by design specifications of the flip wafer for the array of the bump pads.
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Inventors:
QIAN AOFENG (CN)
QIN GANG (CN)
FENG XINPENG (CN)
ZHOU JI (CN)
QIN GANG (CN)
FENG XINPENG (CN)
ZHOU JI (CN)
Application Number:
PCT/CN2021/099357
Publication Date:
February 10, 2022
Filing Date:
June 10, 2021
Export Citation:
Assignee:
NEXTVPU SHANGHAI CO LTD (CN)
International Classes:
H01L21/48; H01L23/498
Foreign References:
| CN111739807A | 2020-10-02 | |||
| CN102487021A | 2012-06-06 | |||
| US20200211994A1 | 2020-07-02 | |||
| CN104851863A | 2015-08-19 | |||
| JP2006100710A | 2006-04-13 |
Attorney, Agent or Firm:
BEIJING HAN KUN LAW OFFICES (CN)
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