Title:
SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/080100
Kind Code:
A1
Abstract:
This semiconductor module comprises a support substrate, a conductive substrate joined to the support substrate, a switching semiconductor element electrically joined to the conductive substrate, and a conductive member that constitutes a path of a main circuit current switched by the semiconductor element. The conductive member is arranged so as to overlap with the main surface of the conductive substrate when viewed in the thickness direction of the support substrate. The conductive member is formed with an opening that overlaps with the main surface of the conductive substrate and does not overlap with the semiconductor element when viewed in the thickness direction.
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Inventors:
TANIKAWA KOHEI (JP)
YAMANE YOSHIHIRO (JP)
YAMANE YOSHIHIRO (JP)
Application Number:
PCT/JP2021/034715
Publication Date:
April 21, 2022
Filing Date:
September 22, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/29; H01L21/60; H01L23/31; H01L23/48; H01L25/07; H01L25/18
Foreign References:
| JP2020072106A | 2020-05-07 | |||
| JP2008098585A | 2008-04-24 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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