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Title:
SHEET-LIKE JOINING MATERIAL AND METHOD FOR PRODUCING SAME, AND JOINED BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2024/106149
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a joining material which makes it possible to achieve sufficient joining strength even in low-temperature joining at 250°C or lower and also makes it possible to achieve such joining that unevenness between the sintering state in a center part and the sintering state in a pressured edge portion in a pressure-joined surface is unlikely to occur. Provided is a sheet-like joining material comprising copper particles and a reducing agent that reduces the copper particles, the sheet-like joining material being characterized in that the copper particles include copper fine particles that have an average particle diameter of 300 nm or less and copper coarse particles that are contained optionally and have an average particle diameter of 3 μm to 11 μm inclusive, the content of the copper fine particles relative to the total content of the copper fine particles and the copper coarse particles is 50% by mass to 100% by mass inclusive, the reducing agent comprises triethanolamine, and the content of the triethanolamine is 1.5% by mass to 10.0% by mass inclusive relative to the total content of the copper fine particles and the copper coarse particles.

Inventors:
MIYOSHI KENTARO (JP)
IGARASHI HIROSHI (JP)
Application Number:
PCT/JP2023/038369
Publication Date:
May 23, 2024
Filing Date:
October 24, 2023
Export Citation:
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Assignee:
TAIYO NIPPON SANSO CORP (JP)
International Classes:
B22F1/10; B22F1/00; B22F1/052; B22F1/14; B22F3/14; B22F7/08
Domestic Patent References:
WO2017057645A12017-04-06
WO2016152214A12016-09-29
WO2016031619A12016-03-03
WO2021149496A12021-07-29
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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