SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS - SONY SEMICONDUCTOR SOLUTIONS CORP

Title:

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

Document Type and Number:

WIPO Patent Application WO/2023/210324

Kind Code:

A1

Abstract:

This disclosure relates to a solid-state imaging device and an electronic apparatus with which it is possible to achieve increased speed for a communication interface. This solid-state imaging device is configured by layering a control substrate and a pixel substrate on which pixels are formed. The pixel substrate has a pad that serves as a contact with an external device. The control substrate has: signal pad wiring connected to the pad; a shield wiring line disposed in the periphery of the signal pad wiring line; and a high resistance element connected to the shield wiring line. This disclosure can, for example, be applied to a solid-state imaging device or the like.

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Inventors:

NAKAMURA TAKASHI (JP)
HIGASHI AKIMI (JP)

Application Number:

PCT/JP2023/014547

Publication Date:

November 02, 2023

Filing Date:

April 10, 2023

Export Citation:

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Assignee:

SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

International Classes:

H01L27/146; H04N25/617; H04N25/70

Foreign References:

JP2012089739A	2012-05-10
JP2007194981A	2007-08-02
JP2020141397A	2020-09-03
JPH10321804A	1998-12-04

Attorney, Agent or Firm:

NISHIKAWA Takashi et al. (JP)

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