Title:
SUBSTRATE HOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/068690
Kind Code:
A1
Abstract:
The present invention addresses the problem of, when a substrate held on a holding plate by the adhesive force of an adhesive member is detached from the adhesive member, enabling the substrate to be appropriately released from the holding plate without causing the substrate to be deformed and the like. When a substrate (1) held on a holding plate (10) by the adhesive force of an adhesive member (21) is detached from the adhesive member and released from the holding plate, a movable member (20) provided with an adhesive member is held by the holding plate in a movable state with respect to the substrate. A splitting means (40) moves the movable member in a direction that causes separation from the substrate so that the movable member is inclined with respect to the substrate, and the held substrate is gradually detached from one end side of the adhesive member provided to the movable member and released from the holding plate.
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Inventors:
TOUCHI HACHIROU (JP)
IWANARI KENJI (JP)
MATSUOKA HIDENOBU (JP)
IWANARI KENJI (JP)
MATSUOKA HIDENOBU (JP)
Application Number:
PCT/JP2012/078099
Publication Date:
May 08, 2014
Filing Date:
October 31, 2012
Export Citation:
Assignee:
CHUGAI RO KOGYO KAISHA LTD (JP)
International Classes:
H01L21/683; G02F1/13; G09F9/00
Foreign References:
| JP2005165159A | 2005-06-23 | |||
| JP2009290006A | 2009-12-10 | |||
| JP2012169405A | 2012-09-06 | |||
| JP2007310041A | 2007-11-29 |
Attorney, Agent or Firm:
MATSUKAWA Katsuaki (JP)
Matsukawa Conscientious (JP)
Matsukawa Conscientious (JP)
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