SUBSTRATE PROCESSING APPARATUS USING A BATCH PROCESSING CHAMBER

WIPO Patent Application WO2006055984

A3

Aspects of the invention include a method and apparatus for processing a substrate using a multi-chamber processing system (e.g., a cluster tool) adapted to process substrates in one or more batch and/or single substrate processing chambers to increase the system throughput. In one embodiment, a system is configured to perform a substrate processing sequence that contains batch processing chambers only, or batch and single substrate processing chambers, to optimize throughput and minimize processing defects. In one embodiment, a batch processing chamber is used to increase the system throughput by performing a process recipe step that is disproportionately long compared to other process recipe steps in the substrate processing sequence. Aspects of the invention also include an apparatus and method for delivering a precursor to a processing chamber so that a repeatable ALD or CVD deposition process can be performed.

JP2005210130	METHOD OF CLEANING EQUIPMENT SURFACES IN SEMICONDUCTOR MATERIAL PROCESSING CHAMBER
JP2000212752	REACTION CHAMBER GAS FLOWING METHOD AND SHOWER HEAD USED THEREFOR
WO/2003/060967	SUSCEPTOR FOR EPITAXIAL GROWTH AND EPITAXIAL GROWTH METHOD

THAKUR RANDHIR P S (US)
GHANAYEM STEVE G (US)
YUDOVSKY JOSEPH (US)
WEBB AARON (US)
BRAILOVE ADAM A (US)
MERRY NIR (US)
SHAH VINAY K (US)
HEGEDUS ANDREAS G (US)

PCT/US2005/042762

August 24, 2006

November 22, 2005

Click for automatic bibliography generation  

APPLIED MATERIALS INC (US)
THAKUR RANDHIR P S (US)
GHANAYEM STEVE G (US)
YUDOVSKY JOSEPH (US)
WEBB AARON (US)
BRAILOVE ADAM A (US)
MERRY NIR (US)
SHAH VINAY K (US)
HEGEDUS ANDREAS G (US)

C23C16/00; C23F1/00; H01L21/306

US6488778B1	2002-12-03
US5294572A	1994-03-15
US6364762B1	2002-04-02

View/Download PDF      PDF Help

Previous Patent: METHOD AND APPARATUS FOR A RANKING ENGINE

Next Patent: SERVICE AUTHORIZATION IN A WI-FI NETWORK INTERWORKED WITH 3G/GSM NETWORK