Title:
SUCKING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2005/104201
Kind Code:
A1
Abstract:
A wafer (W) is supported on a ring frame (R) from a rear side through a dicing tape (T), and a protection tape (H) is adhered on a front side of the wafer. A sucking apparatus (12) is provided with a table (16) having a sucking plane (15) on an upper surface. The sucking plane (15) sucks the dicing tape (T) by prescribed suction to hold the wafer (W). A groove (24) is formed at least in a part of an area along an outer circumference of the sucking plane (15), suction is performed by the sucking plane (15), and the dicing tape (T) is depressed by having the inside of the groove (24) depressurized.
Inventors:
KOBAYASHI KENJI (JP)
TSUJIMOTO MASAKI (JP)
YOSHIOKA TAKAHISA (JP)
TSUJIMOTO MASAKI (JP)
YOSHIOKA TAKAHISA (JP)
Application Number:
PCT/JP2005/007500
Publication Date:
November 03, 2005
Filing Date:
April 20, 2005
Export Citation:
Assignee:
LINTEC CORP (JP)
KOBAYASHI KENJI (JP)
TSUJIMOTO MASAKI (JP)
YOSHIOKA TAKAHISA (JP)
KOBAYASHI KENJI (JP)
TSUJIMOTO MASAKI (JP)
YOSHIOKA TAKAHISA (JP)
International Classes:
H01L21/677; H01L21/00; H01L21/304; H01L21/68; H01L21/683; (IPC1-7): H01L21/304
Foreign References:
| JP2003173996A | 2003-06-20 | |||
| JP2001319906A | 2001-11-16 | |||
| JPS5930631A | 1984-02-18 |
Attorney, Agent or Firm:
Yamaguchi, Yoshio (Izumi Building 4-17, Tsurumaki 1-chome, Tama-sh, Tokyo 34, JP)
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