Title:
WIRE BOND-LESS ELECTRONIC COMPONENT FOR USE WITH AN EXTERNAL CIRCUIT AND METHOD OF MANUFACTURE
Document Type and Number:
WIPO Patent Application WO2003060998
Kind Code:
B1
Abstract:
A wire bond-less electronic component is for use with a circuit external to the wire bond-less electronic component. The wire bond-less electronic component includes a support substrate (110, 410), an electronic device (130) over the support substrate, and a cover (140, 440, 540) located over the electronic device and the support substrate. The cover includes an interconnect structure (141, 441, 541) electrically coupled to the electronic device and adapted to electrically couple together the electronic device and the circuit for providing impedance transformation of an electrical signal between the electronic device and the circuit.
Inventors:
VISWANATHAN LAKSHMINARAYAN
PIEL PIERRE-MARIE J
FUNK GARRY DUANE
DAVIDSON ROBERT P
PIEL PIERRE-MARIE J
FUNK GARRY DUANE
DAVIDSON ROBERT P
Application Number:
PCT/US2002/039980
Publication Date:
December 18, 2003
Filing Date:
December 16, 2002
Export Citation:
Assignee:
MOTOROLA INC (US)
International Classes:
H01L23/053; H01L23/10; H01L23/66; H01L23/02; (IPC1-7): H01L23/14; H01L23/485
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