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WO/2024/099871A1 |
The present disclosure relates to battery compartment assemblies and more specifically to battery compartment assemblies that provide conductive power contacts used to supply to power to, for example, a medical device. The battery compar...
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WO/2024/099704A1 |
The present invention relates to an electronic device (1), which comprises a housing (2) and an electronic assembly (3). The electronic assembly (3) is fixed in the housing (2) by means of a filling compound (4). The filling compound (4)...
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WO/2024/098112A1 |
A cooling tank for cooling computing devices using liquid immersion is disclosed. The cooling tank comprises: a container configured to receive coolant in a cavity of the container; a separation panel dividing the container cavity into a...
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WO/2024/101737A1 |
The present invention relates to a ceramic substrate for a power module and a manufacturing method thereof. A ceramic substrate for a power module according to one embodiment of the present invention may comprise: a ceramic substrate; an...
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WO/2024/098111A1 |
Described embodiments generally relate to a cooling system for cooling computing devices. The cooling system comprises at least one cooling tank configured to hold a first cooling fluid and sized to at least partially immerse at least on...
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WO/2024/103024A1 |
Presented herein are systems, apparatuses, devices, and methods for deactivating high power converters and inverters in shutdown and fault events. An apparatus can include an inverter electrically coupled with a power supply. The inverte...
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WO/2024/102578A1 |
To minimize use of power required for cooling and get ahead of temperature buildup, a mode of operation can be established for a cooling element (306) of a device (208, 210) based on one or more non-temperature factor values. For example...
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WO/2024/098549A1 |
A rotating assembly (10). The rotating assembly (10) comprises: a first rotating shaft assembly (100), a first fixing plate (200) sleeved on the first rotating shaft assembly (100), and a second fixing plate (300) sleeved on the first ro...
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WO/2024/100994A1 |
The present invention improves the cooling performance of a semiconductor chip that is cooled by a Peltier element, while making an electrical connection to the outside possible. A Peltier element according to the present invention is ...
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WO/2024/102003A1 |
An adapter handset (10) is provided for electrically interfacing with a desk controller (2) of an electrically powered sit-stand desk (1). The adapter handset (10) includes a multi-pin handset connector (7) and a processor (4). The desk ...
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WO/2024/098849A1 |
A thermal management system (100) and a vehicle. The thermal management system (100) comprises: a battery temperature control loop (10), a chiller heat exchanger (101) being disposed on the battery temperature control loop (10); and an e...
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WO/2024/098592A1 |
Disclosed in the present application are a liquid-cooling heat dissipation plate and a liquid-cooling electronic device. The liquid-cooling heat dissipation plate comprises a cooling plate unit, a liquid inlet and a liquid outlet being f...
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WO/2024/016744A9 |
Embodiments of the present application provide a foldable screen device, which at least comprises a housing, an electric connecting wire, and a shaping part. The housing comprises a rotating shaft assembly, a frame body, and an accommoda...
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WO/2024/098925A1 |
Embodiments of the present application disclose a computing device and a computing node, wherein the computing device may specifically be a server or the like, and accordingly, the computing node may specifically be a server node or the ...
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WO/2024/098110A1 |
Embodiments generally relate to systems for cooling computing devices using liquid immersion. An example system includes: a plurality of open cooling tanks, each cooling tank defining an interior volume to receive computing devices and t...
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WO/2024/098790A1 |
The present application relates to an electronic assembly and an electronic device. The electronic assembly comprises a liquid cooling heat dissipation module and a plurality of floating modules, wherein the plurality of floating modules...
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WO/2024/099236A1 |
An in-vehicle heat-pipe heat dissipation controller, and a vehicle, which relate to the technical field of controllers, and aim to solve the problem of an increase in the maintenance costs caused by the short circuit of a circuit board a...
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WO/2024/099817A1 |
The present disclosure relates to battery compartment assemblies and more specifically to battery compartment assemblies that provide conductive battery contacts used to facilitate the supply of power to, for example, a medical device. T...
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WO/2024/098476A1 |
Provided are a water-cooling system and method for a traction converter, and a controller and a traction system. The water-cooling system comprises: a water pump (1), which is used for providing a cooling liquid for the water-cooling sys...
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WO/2024/102562A1 |
An assembly for two (or more) DC/DC converters located in a common enclosure, where the DC/DC converters share a heat sink assembly, such as a shared dual-sided heat sink assembly. The techniques efficiently package the components of the...
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WO/2023/064270A9 |
The present disclosure refers to methods of employing a computer comprising a pulse width modulated controlled cooling fan in an immersion cooling process. The present disclosure also refers to devices therefore. Such methods and devices...
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WO/2024/095685A1 |
A cooling module according to the present invention includes: a substrate on which a driver for energizing an auxiliary machine installed on a vehicle is mounted; and a module housing for holding the substrate. The module housing has a f...
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WO/2024/093214A1 |
The present application belongs to the field of communication equipment and discloses a chip heat dissipation assembly and an electronic device. The chip heat dissipation assembly comprises: a circuit board, a chip assembly, a supporting...
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WO/2024/093433A1 |
A wireless charging base (100) and a wireless charging system, which relate to the technical field of charging devices, and aim to solve the problem of how to achieve heat dissipation of an electric device (200) during charging to ensure...
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WO/2024/095653A1 |
[Problem] To achieve both simplification of a device and high cooling efficiency of insulating oil that has received heat. [Solution] This cooling device cools a power semiconductor apparatus. The cooling device includes: a tank which ac...
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WO/2024/097055A1 |
Data storage systems may include a chassis with a first end and a second end. One or more fans may be positioned at the first end of the chassis. At least one storage media device may be positioned inside the chassis and behind the at le...
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WO/2024/093695A1 |
A liquid-cooling heat dissipation module embedded with a three-dimensional vapor chamber element, the module comprising a three-dimensional vapor chamber element and a semi-open shell, wherein the three-dimensional vapor chamber element ...
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WO/2024/096302A1 |
An inverter unit that drives a compressor motor comprises, in order for a plurality of inverter elements installed on a seating surface of an inverter housing to be individually fixed to the seating surface, an insulating member which is...
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WO/2024/094807A1 |
The invention relates to a cooling device (1) which comprises at least one central electronics unit (2), which comprises at least two active units (3-8) arranged at a distance from the central electronics unit (2) and which comprises at ...
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WO/2024/093168A1 |
The present application provides a directional temperature control intelligent cabinet and a micro data center. The intelligent cabinet comprises an integrated cabinet and a plurality of IT cabinets, wherein the bottom of the integrated ...
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WO/2024/093689A1 |
A three-dimensional vapor chamber element and a manufacturing method therefor. The three-dimensional vapor chamber element comprises an upper cover, a lower cover, a porous capillary structure, and a working fluid; the upper cover compri...
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WO/2024/093506A1 |
An enclosure (100) and an electronic device (1000), which are used for reducing the effect of the environment on the temperature of the electronic device (1000), and improving the thermal experience of electronic products and the use exp...
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WO/2024/094026A1 |
A heat dissipation system and an electronic device. The heat dissipation system comprises: a mounting box (31), the mounting box (31) being used for accommodating a circuit board of a circuit board assembly; and a fan assembly (41), comp...
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WO/2024/093228A1 |
Disclosed in the present invention are an energy storage system and a thermal management apparatus thereof. The thermal management apparatus of the energy storage system comprises: at least one heat exchange module, and a cooling module,...
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WO/2024/093169A1 |
Provided in the present application are an intelligent cabinet and a micro data center. The intelligent cabinet comprises a main cabinet body composed of a frame assembly and a support assembly, wherein a mounting space is formed inside ...
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WO/2024/066703A9 |
Provided in the present application are a heat dissipation system and a power apparatus. The heat dissipation system comprises a power module, an evaporator and a condenser, wherein the power module comprises a thermally conductive subst...
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WO/2024/094299A1 |
Embodiments described herein relate to methods and apparatus for monitoring flow devices. In one aspect there is provided a method comprising driving a first said airflow device (120a) at a predetermined level to generate an airflow (425...
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WO/2024/092973A1 |
A heat transfer apparatus (400) and an electronic device. The electronic device comprises a rotary shaft mechanism (200), and a first main body (110) and a second main body (120) which are connected to each other in a rotational manner b...
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WO/2024/066705A9 |
The present application provides a heat dissipation system and a power apparatus. The heat dissipation system can comprise a power module and a condenser. The power module can comprise a base and a power device, the base is provided with...
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WO/2024/092617A1 |
A heat exchange apparatus(100) and a method for manufacturing the heat exchange apparatus(100). The heat exchange apparatus(100) comprises a first heat conducting member(101) having a first side(1011) and a second side(1012) opposite to ...
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WO/2024/093243A1 |
The present application provides an electronic assembly and a terminal device. The electronic assembly comprises: a first component; a second component, an accommodating space being formed between the second component and the first compo...
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WO/2024/090444A1 |
An information processing device according to the present disclosure comprises: an information acquisition unit which can acquire a plurality of pieces of information related to a vehicle; an inference unit which calculates index values ...
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WO/2023/226608A9 |
Provided in an embodiment of the present application is an electronic device, comprising at least a shell and a first display. The shell comprises a first frame body, a second frame body, and a hinge. The hinge is connected to the first ...
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WO/2024/090236A1 |
The present invention is a heat transfer member which is applied to a cooling device (100), which cools an object-to-be-cooled (70) in a state of being immersed in a liquid refrigerant and promotes heat transfer to the refrigerant from t...
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WO/2024/090334A1 |
This projection display device (100) comprises a reflective liquid crystal display element (1), a heat sink (2), a heat generation source (3), and a cooling fan (5). In at least one direction among the long side direction and the short s...
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WO/2024/091980A1 |
A cold plate assembly includes a thermally conductive cold plate having a first surface attachable to a heat generating electronic component of an information processing system. An opposite second surface includes an array of hollow rise...
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WO/2024/091605A1 |
A method and apparatus for an evaporator assembly are provided. The evaporator assembly includes an evaporator body, a coating basin, and a porous media. The evaporator body includes an evaporator sidewall, an evaporator volume defined b...
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WO/2024/090390A1 |
This information processing device comprises: a first processor for outputting point information obtained by capturing an imaged object as a point, from an image of the object imaged using a first camera; and a second processor for outpu...
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WO/2024/087284A1 |
The present invention relates to the technical field of cable trays. Specifically, disclosed is a dustproof cable tray, comprising first partition plates. Fixing backets are fixedly connected to two ends of the lower surface of each firs...
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WO/2024/089674A1 |
A cooling device for a solid-state electronics component is provided for electronics one or more electronics components that heats during The cooling device includes a chamber having a first region defining a pool with a heat conducting ...
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