Title:
METHOD FOR MANUFACTURING GLASS SUBSTRATE HAVING HOLE USING LASER
Document Type and Number:
Japanese Patent JP2019206460
Kind Code:
A
Abstract:
To efficiently manufacture a glass substrate having a hole using a laser having a wavelength having a small absorbance to glass.SOLUTION: The method for manufacturing a glass substrate having a hole comprises the steps of: preparing a glass substrate having first and second substrates facing each other; installing an absorption layer having a function absorbing at least a part of energy of a laser on at least one of the first and second surfaces of the glass substrate; and forming the hole having a diameter of 20-80 μm and a depth of 10-700 μm in the glass substrate by continuously oscillating the laser having an average output of 50-500 W and having a wavelength having 0.5 cmor less of an absorption coefficient of the glass substrate to irradiate the first surface of the glass substrate with a laser beam for an irradiation time of 1 ms or less.SELECTED DRAWING: Figure 1
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Inventors:
HORIUCHI KOHEI
Application Number:
JP2018103434A
Publication Date:
December 05, 2019
Filing Date:
May 30, 2018
Export Citation:
Assignee:
AGC INC
International Classes:
C03B33/09; B23K26/18; B23K26/382; B23K26/402; C03B25/02; C03C15/00; C03C17/22
Domestic Patent References:
| JP3001816B2 | 2000-01-24 | |||
| JP2000301372A | 2000-10-31 |
Foreign References:
| WO2002081142A1 | 2002-10-17 |