半導体装置 - Mitsubishi Electric Corporation

Title:

半導体装置

Document Type and Number:

Japanese Patent JP4004460

Kind Code:

B2

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Inventors:

Kuriaki Kazuhiro

Application Number:

JP2003418144A

Publication Date:

November 07, 2007

Filing Date:

December 16, 2003

Export Citation:

Assignee:

Mitsubishi Electric Corporation

International Classes:

H01L25/07; H01L23/50; H01L25/18

Domestic Patent References:

Attorney, Agent or Firm:

Shigeaki Yoshida
Yoshitake Hidetoshi
Takahiro Arita

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