Title:
ボールボンディングにおいて小径ワイヤにより構成されたボンドの強度を増加するシステム及び方法
Document Type and Number:
Japanese Patent JP5547360
Kind Code:
B2
Abstract:
A system and method is disclosed for increasing the strength of a bond made by a small diameter wire in ball bonding. In one embodiment of the invention a structure for receiving a ball bond comprises substrate material that has portions that form a substrate cavity and a wire bond pad that covers and fills the substrate cavity. The wire bond pad also has portions that form a wire bond cavity for receiving the ball bond. The ball is wirebonded to the sides and bottom of the wire bond cavity. The sides of the wire bond cavity provide additional strength to the bond to resist shear and tensile forces that may act on the wire.
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Inventors:
Anthony M. チュウ
Application Number:
JP2004194272A
Publication Date:
July 09, 2014
Filing Date:
June 30, 2004
Export Citation:
Assignee:
S tea microelectronics, in condominium lei テッド STMicroelectronics and Inc
International Classes:
H01L21/60; H01L23/485
Attorney, Agent or Firm:
Masaaki Kobashi