Title:
硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物
Document Type and Number:
Japanese Patent JP6649494
Kind Code:
B2
Abstract:
[Problem] To provide a curable organopolysiloxane composition, etc. which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing.[Resolution means] A curable organopolysiloxane composition, containing:(A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.
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Inventors:
Toyohiko Fujisawa
Masayuki Onishi
Masayuki Onishi
Application Number:
JP2018537193A
Publication Date:
February 19, 2020
Filing Date:
August 24, 2017
Export Citation:
Assignee:
Dow Toray Co., Ltd.
International Classes:
C08L83/07; C08K3/013; C08K5/54; C08L83/05; C09J11/06; C09J183/04; C09J183/07; H01L23/29; H01L23/31
Foreign References:
| WO2016038836A1 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe
Shinya Mitsuhiro
Tatsuhiko Abe