Title:
回路基板製造方法
Document Type and Number:
Japanese Patent JP6674839
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board capable of appropriately following various shapes.SOLUTION: A method for manufacturing a circuit board includes: a mounting step (ST2) of mounting electronic components on a mounting surface of a circuit board manufacturing intermediate body including the mounting surface on which the electronic components are mounted, a plurality of laminated insulating layers with insulation properties, and a conductive layer with conductive properties which is provided on at least some of the plurality of insulating layers and to which the electronic components are electrically connected; and a cutting step (ST3) of cutting a part of the insulating layers of the circuit board manufacturing intermediate body after the mounting step (ST2).SELECTED DRAWING: Figure 5
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Inventors:
Kaori Haruyuki
Tomohiro Sugiura
Tomohiro Sugiura
Application Number:
JP2016099502A
Publication Date:
April 01, 2020
Filing Date:
May 18, 2016
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
H05K3/46; H05K1/02; H05K3/00
Domestic Patent References:
| JP2004140018A | ||||
| JP730251A | ||||
| JP2004111563A | ||||
| JP8102568A |
Foreign References:
| US20040118595 | ||||
| US20090020326 |
Attorney, Agent or Firm:
Toranomon Intellectual Property Office