Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP7398554
Kind Code:
B2
Abstract:
A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are bonded to each other includes a holding member configured to hold the combined substrate; a removing member configured to separate at least a peripheral portion of the first substrate from the second substrate by being inserted between the first substrate and the second substrate; an elevating mechanism configured to adjust a relative height position of the removing member with respect to the holding member; and a controller configured to control an operation of the elevating mechanism. The controller controls the operation of the elevating mechanism such that the relative height position of the removing member with respect to a target insertion position of the removing member is adjusted in an entire circumference of the combined substrate.
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Inventors:
Yohei Yamawaki
Seiji Nakano
Tokutaro Hayashi
Seiji Nakano
Tokutaro Hayashi
Application Number:
JP2022516887A
Publication Date:
December 14, 2023
Filing Date:
March 16, 2021
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304
Domestic Patent References:
| JP3225828U | ||||
| JP2008537316A |
Foreign References:
| US20160093518 | ||||
| WO2019176589A1 | ||||
| WO2019208359A1 | ||||
| WO2019208298A1 |
Attorney, Agent or Firm:
Tetsuo Kanemoto
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine