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Title:
ACTIVE RAY SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE RAY SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMATION METHOD AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2017116880
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an active ray sensitive or radiation sensitive resin composition excellent in roughness property and capable of suppressing generation of application defect and a pattern formation method using the same.SOLUTION: An active ray sensitive or radiation sensitive resin composition contains (A) a resin containing a repeating unit having at least 2 lactone structures and (B) a compound generating acid by irradiation of active ray or radiation and percentage content of a fluorine atom of the compound is 0 to 0.20 based on total mass of the total atom contained in the compound.SELECTED DRAWING: None

Inventors:
TANAKA TAKUMI
FURUYA SO
GOTO AKIYOSHI
Application Number:
JP2015255178A
Publication Date:
June 29, 2017
Filing Date:
December 25, 2015
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/004; C08F20/18; G03F7/038; G03F7/039; G03F7/20
Attorney, Agent or Firm:
Kurata Masatoshi
Nobuhisa Nogawa
Takashi Mine
Naoki Kono
Katsu Sunagawa
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi