Title:
APPARATUS AND METHOD FOR LASER BEAM MACHINING
Document Type and Number:
Japanese Patent JP3926620
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for laser beam machining which can form high- quality via holes by machining at a high speed even in a laser beam machining apparatus using a beam scan optical system and to provide a laser beam machining apparatus.
SOLUTION: The number of times of irradiation with a laser beam 7 and a reference value of intensity of a polarized light component contained in light 18 reflected from a machining site for each of the number of times of irradiation are predetermined. For each irradiation with the laser beam 7, the intensity of the polarized light component in the reflected light 18 is measured with sensors 23, 24. If the measured value satisfies the predetermined reference value, then a next laser beam 7 is applied. In the other cases and if the number of times of irradiation exceeds the predetermined value, the machining is stopped.
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Inventors:
Hiroyuki Sugawara
Sadao Mori
Hiroshi Aoyama
Sadao Mori
Hiroshi Aoyama
Application Number:
JP2001386500A
Publication Date:
June 06, 2007
Filing Date:
December 19, 2001
Export Citation:
Assignee:
Hitachi Via Mechanics, Ltd.
International Classes:
B23K26/00; B23K101/42; (IPC1-7): B23K26/00; //B23K101:42
Domestic Patent References:
| JP2000117474A | ||||
| JP10085976A |
Attorney, Agent or Firm:
Kenjiro Take