Title:
Back lighting solid image sensor
Document Type and Number:
Japanese Patent JP6165630
Kind Code:
B2
Abstract:
A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
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Inventors:
Hampston, Giles
Kleemann, Moshe
Kleemann, Moshe
Application Number:
JP2013537697A
Publication Date:
July 19, 2017
Filing Date:
October 25, 2011
Export Citation:
Assignee:
Inventus Corporation
International Classes:
H01L23/12; H01L27/146
Domestic Patent References:
| JP2009016691A | ||||
| JP2008288595A | ||||
| JP62291163A | ||||
| JP63292672A | ||||
| JP2009016431A |
Foreign References:
| US20100006963 | ||||
| WO2008093531A1 |
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Ayako Nakamura
Satoshi Morimoto
Arihara Koichi
Matsushima Tetsuo
Ayako Nakamura
Satoshi Morimoto
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