Title:
回路基板の放熱構造
Document Type and Number:
Japanese Patent JP7135514
Kind Code:
B2
Abstract:
To provide a heat dissipation structure of a circuit board that makes it easy for a capacitor to absorb noise generated by a switching element and reduces the influence of heat applied to the capacitor.SOLUTION: An FET 6 that controls current supplied to a load through a switching operation and an aluminum electrolytic capacitor 8 connected between terminals of a driving power supply are surface-mounted on corresponding mounting areas on different surfaces of a multilayer substrate 11. Then, in the inner layer of the multilayer substrate 11, copper foil patterns 15 and 16 are arranged so as to avoid the portions corresponding to the mounting areas.SELECTED DRAWING: Figure 2
More Like This:
Inventors:
Kazuyuki Watanabe
Application Number:
JP2018129934A
Publication Date:
September 13, 2022
Filing Date:
July 09, 2018
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H05K1/02; H01L23/12; H01L23/34; H01L23/36; H02M7/48; H05K3/46; H05K7/20
Domestic Patent References:
| JP9008482A | ||||
| JP11317490A | ||||
| JP2006339466A | ||||
| JP2017147259A | ||||
| JP201166332A |
Foreign References:
| WO2009081518A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Sato
Previous Patent: Semiconductor modules for DC-DC converters
Next Patent: POLYPHASE MODULATION CIRCUIT AND POLYPHASE DEMODULATION CIRCUIT
Next Patent: POLYPHASE MODULATION CIRCUIT AND POLYPHASE DEMODULATION CIRCUIT