Title:
ELECTROMAGNETIC WAVE SHIELDING FILM AND WIRING BOARD
Document Type and Number:
Japanese Patent JP2011086930
Kind Code:
A
Abstract:
To provide an electromagnetic wave shielding film which is applied to a flexible printed wiring board or the like, and is excellent in electromagnetic wave shielding property, adhesion power, and flexibility.
The electromagnetic wave shielding film includes an insulating layer, and a conductive layer. and has 40 to 90 dB electromagnetic wave shielding property at a frequency of 1 GHz through a KEC process. The conductive layer contains a flaky silver particle having a 50% particle diameter measured through a laser diffraction process in a range from 1 μm through 20 μm, and a bulky density from 0.2 g/cm3 through 0.7 g/cm3.
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Inventors:
NISHIYAMA YUJI
KOBAYASHI HIDENORI
MATSUZAWA TAKAHIRO
KOBAYASHI HIDENORI
MATSUZAWA TAKAHIRO
Application Number:
JP2010208686A
Publication Date:
April 28, 2011
Filing Date:
September 17, 2010
Export Citation:
Assignee:
TOYO INK MFG CO
International Classes:
H05K9/00
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