Title:
ELECTRONIC CONTROL DEVICE
Document Type and Number:
Japanese Patent JP2015088629
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To solve such problems that, in conventional techniques, while a thermally conductive elastic member is interposed between a heating element and a heat release destination-housing to form a heat dissipation structure, it is not considered to improve heat dissipation properties furthermore by reducing the thickness of the thermally conductive elastic member furthermore to reduce thermal resistance, and also failures/breakages of the heating element are not considered, the failures/breakages occurring due to contact/interference between the heating element and the heat release destination-housing which may be caused in generation of oscillation or the like by reducing the thickness of the thermally conductive elastic member.SOLUTION: A projecting portion is provided in a heat release destination-housing, in a heat dissipation structure where heat is dissipated from the top surface of a heating element to a housing.
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Inventors:
OKADA MASAHIRO
TANABE ITARU
TANABE ITARU
Application Number:
JP2013226133A
Publication Date:
May 07, 2015
Filing Date:
October 31, 2013
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD
International Classes:
H05K7/20; H01L23/36
Domestic Patent References:
| JP2004274018A | 2004-09-30 | |||
| JP2002330523A | 2002-11-15 | |||
| JPS4974911U | 1974-06-28 | |||
| JP2011035106A | 2011-02-17 |
Attorney, Agent or Firm:
Manabu Inoue
Yuji Toda
Shigemi Iwasaki
Yuji Toda
Shigemi Iwasaki