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Patent Searching and Data


Title:
ELECTRONIC PART ASSEMBLY
Document Type and Number:
Japanese Patent JP2000307289
Kind Code:
A
Abstract:

To prevent electromagnetic waves from entering each input-output terminal by providing an electromagnetic shielding member for input-output terminal on the whose surroundings of a plurality of input-output terminals for connecting electronic components to a mounting substrate.

An electronic component is covered with a metallic case 4 of an electronic shielding member for electronic part and shielded from electromagnetic waves. Then, a high height dam 5, an electromagnetic shielding member for input-output terminal for absorbing external electromagnetic waves, is arranged on the whole surroundings of a plurality of I/O pins. The high height dam 5 which is made of a conductive member, is positioned in the bottom side of an electronic part to provide it so as to be bonded on a mounting substrate 2 in the condition of closely contacting with the bottom of the electronic part. Furthermore, the I/O pins 3 are insulated from the metallic case 4 by a insulation member 7, and is bonded with a pad 6 for input-output terminal provided on the side of the mounting substrate 2 by a solder 8.


Inventors:
MATSUZAWA HAJIME
TAMURA HIROYOSHI
Application Number:
JP11058399A
Publication Date:
November 02, 2000
Filing Date:
April 19, 1999
Export Citation:
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Assignee:
NEC CORP
International Classes:
H05K3/34; H01L23/552; H05K1/02; H05K9/00; (IPC1-7): H05K9/00; H05K3/34
Attorney, Agent or Firm:
Takahashi Isamu