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Patent Searching and Data


Title:
EPOXY RESIN BLEND
Document Type and Number:
Japanese Patent JPH04268320
Kind Code:
A
Abstract:

PURPOSE: To obtain a low viscosity epoxy resin composition to be cured into a high strength complex by incorporating three kinds of specified resinous epoxy compounds and an aromatic amine curing agent.

CONSTITUTION: (A) About 47-56 wt.% of glycidyl ether of formula I ((a) is 0.5-3) as a reaction product of bisphenol A and epichlorohydrin and having about two epoxy groups per one mole, (B) (a) a glycidyl ether of bisphenol A different from A, (b) about 12-50 wt.% of the blend of a copolymer of ethylhexylacrylate and glycidylmethacryalate in a ratio of 50/50-95/50, (C) about 16-28 wt.% of neopentylglycol glycidylether of formula II, and (D) aromatic amine curing agents of formula III, formula IV, and formula V in enough amounts to generate a resin precursor having an amine/epoxy ratio of 1.11/1 are incorporated to obtain the objective epoxy resin blend suitable for resin transfer molding and wet filament winding.


Inventors:
DEBITSUDO AREKISANDAA KUROSUBI
KENESU AREN ROU
Application Number:
JP30075291A
Publication Date:
September 24, 1992
Filing Date:
November 15, 1991
Export Citation:
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Assignee:
HERCULES INC
International Classes:
C08G59/00; C08G59/20; C08G59/22; C08G59/38; C08G59/50; C08J5/24; C08L63/00; (IPC1-7): C08G59/22; C08G59/50; C08J5/24; C08L63/00
Attorney, Agent or Firm:
Kazuo Shamoto (5 outside)