PURPOSE: To make it possible to conduct reliably a bonding of the inner lead parts of a film carrier on electrode parts on a semiconductor chip and to make the prevention of the deformation of the inner lead parts, the protection of the chip and the like possible.

CONSTITUTION: Inner leads 31 of leads 3 of a film carrier 1 are provided on a base film 2 and a through hole 22 is formed in the film 2 to oppose to the surface of a semiconductor chip 5. After bumps 4 on the leads 31 are made to make contact with electrodes on the chip 5, the peripheries of the abutment parts are covered with a resin 8 to seal a space, which is encircled with the film 2 and the chip 5, and the air in the space is vacuum-sucked by a tool 11 through the hole 22 formed in the film 2, whereby the chip 5 is attracted to the side of the film 2 and the bumps 4 on the leads 31 are jointed with the electrodes.