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Patent Searching and Data


Title:
LEAD FRAME AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH07211750
Kind Code:
A
Abstract:

PURPOSE: To make it possible to conduct reliably a detection of recognition marks using light by a method wherein recognition mark metal layers, which consist of the same material as that for inner leads respectively have each recognition mark formed by opening each through hole, are bonded on the bonded surface of a reinforcing tape in such a way that the mark protrudes from the tape.

CONSTITUTION: The base end parts of the rears of inner leads 4 are respectively connected to the point part of the surface of each outer lead 1 via an intermediate metal layer 2 and a reinforcing tape 8 for fixing the positional relation between the inner leads 4 is bonded on the surfaces of the inner leads 4. In such a lead frame, recognition mark metal layers 5, which consist of the same material as that for the leads 4 and respectively have a recognition mark 7 formed by opening each through hole 6, are bonded on the bonded surface of the tape 8 in such a way that the mark 7 protrudes from the tape 8. For example, the leads 1 are formed of a copper foil and the leads 4 and the layers 5 are formed of a copper plated layer.


Inventors:
NAGANO MUTSUMI
OSAWA KENJI
ITO MAKOTO
Application Number:
JP2334494A
Publication Date:
August 11, 1995
Filing Date:
January 24, 1994
Export Citation:
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Assignee:
SONY CORP
International Classes:
H01L21/60; H01L23/50; (IPC1-7): H01L21/60; H01L23/50
Attorney, Agent or Firm:
Hideaki Ogawa