Title:
UNDERFILL MATERIAL, SEMICONDUCTOR DEVICE AND INSPECTION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2007250590
Kind Code:
A
Abstract:
To provide an underfill material filling the gap between a semiconductor chip and a substrate for mounting the semiconductor chip in which detection of void is facilitated.
The underfill material filling the gap between a semiconductor chip and a substrate for mounting the semiconductor chip comprises a curing resin material, and metal particles having a high X-ray shielding rate added to the curing resin material. The surface of the metal particle is coated with a nonconductive material.
COPYRIGHT: (C)2007,JPO&INPIT
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Inventors:
AKAMATSU TOSHIYA
Application Number:
JP2006068126A
Publication Date:
September 27, 2007
Filing Date:
March 13, 2006
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L23/29; H01L21/56; H01L21/60; H01L23/31
Attorney, Agent or Firm:
Tadahiko Ito