Title:
フレキシブル多層基板と回路基板の接合構造、フレキシブル多層基板の製造方法、およびフレキシブル多層基板と回路基板の接合方法
Document Type and Number:
Japanese Patent JP6569780
Kind Code:
B2
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Inventors:
Water Kuniaki
Application Number:
JP2018122728A
Publication Date:
September 04, 2019
Filing Date:
June 28, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K1/14; H05K3/46
Domestic Patent References:
| JP9139576A | ||||
| JP9245856A | ||||
| JP2004039793A | ||||
| JP2008091603A | ||||
| JP2004111701A | ||||
| JP63184394A |
Attorney, Agent or Firm:
Kaede International Patent Office