To obtain the subject resin suitable as a polymer component for alkali developing type photosensitive resin compositions used for production of printed circuit board, etc., by introducing a polyoxyalkylene skeleton into a base polymer.

This resin has a repeating unit represented by formula I [R1 is a 6-30C quadrivalent tetracarboxylic acid residue; R2 is a 1-10C alkylene; (n) is 2-500] and has 10,000 to 200,000 weight-average molecular weight. Furthermore, the objective resin is obtained by reacting a diamine containing a polyoxyalkylenediamine represented by formula II as an essential component and 2,2-bis[4-(4-aminophenoxy)phenyl]propane with a tetracarboxylic anhydride represented by formula III.