INSERT MOLDING CASE AND SEMICONDUCTOR DEVICE - Mitsubishi Electric Corporation

Title:

INSERT MOLDING CASE AND SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP3715590

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To firmly fix a terminal to an insulating case body in an insert molding case.
SOLUTION: A terminal 150 is formed of a plate-like member bent to an L-shape and includes a first part 151 and a second part 152 forming each side of the L-shape. The second part 152 is embedded and inserted inside a case body 110 so that a bonding surface 153 is exposed. Projections 111 of the case body 110 are formed on both sides of the second part 512 in the width direction DW of the second part 152, and the projection 111 is in contact with the side 155 of the second part and projects outside the bonding surface 153. A distance L1 between the projections 111 and the width L2 of the second part 152 satisfy an expression of L1≤L2 and L1≉L2.

More Like This:

JP2008118140	SEMICONDUCTOR CHIP STACK PACKAGE WITH REINFORCING MEMBER FOR PREVENTING WARPAGE CONNECTED TO SUBSTRATE
JP5091532	Semiconductor devices and their manufacturing methods and manufacturing devices
JP3250992	LAMINATED CHIP PACKAGE

Inventors:

Tatsuya Iwasa
Yoshihisa Oguri
Hideki Tsukamoto

Application Number:

JP2002175743A

Publication Date:

November 09, 2005

Filing Date:

June 17, 2002

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Mitsubishi Electric Corporation

International Classes:

H01L25/07; H01L23/08; H01L25/18; (IPC1-7): H01L23/08; H01L25/07; H01L25/18

Domestic Patent References:

JP2000208655A
JP11068013A
JP7010947U
JP60200544A

Attorney, Agent or Firm:

Shigeaki Yoshida
Yoshitake Hidetoshi
Takahiro Arita

Previous Patent: METHOD FOR DIAGNOSING ACID BUFFERING CAPACITY OF FOREST SOIL AND ACID RAIN USEFUL LIFE, AND METHOD F...

Next Patent: METHOD FOR PRODUCING FILTER RAW MATERIAL, METHOD FOR PRODUCING PHOTOCATALYTIC FILTER RAW MATERIAL, P...