Title:
INSPECTING EQUIPMENT FOR LEAD FORMING
Document Type and Number:
Japanese Patent JPH0521560
Kind Code:
A
Abstract:
PURPOSE: To reduce arrangement area, improve operational capability and reduce cost.
CONSTITUTION: A mirror 1 reflecting an optical image from a tip part 4a of a lead 4 protruding from the side surface of a semiconductor device 2 in the same direction as an optical image from a plane part 4b is installed, and images of the tip part 4a of the lead 4 and the plane part 4b are picked up by using one camera 3.
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Inventors:
IMADA TAKASHI
Application Number:
JP17083591A
Publication Date:
January 29, 1993
Filing Date:
July 11, 1991
Export Citation:
Assignee:
NEC YAMAGATA LTD
International Classes:
H01L21/66; H01L23/50; (IPC1-7): H01L21/66; H01L23/50
Domestic Patent References:
| JPS63190354A | 1988-08-05 |
Attorney, Agent or Firm:
Uchihara Shin