Title:
INSPECTION METHOD FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, INSPECTION METHOD FOR ELECTRONIC APPARATUS AND THE ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2003121504
Kind Code:
A
Abstract:
To easily inspect individual semiconductor chips, in a state attached to a circuit board.
The semiconductor chips 62 (62a-62c) constituting a semiconductor device 60 are electrically connected to each other by chip connection wirings 40 (40a-40d). Cut-off parts 68 (68a-68d) are provided to respective chip connection wirings 40, so as to arbitrarily and electrically connect and cut off the semiconductor chips 62. Inspection pads 66 (66a-66h) are connected to both sides of the cut-off parts 68 of the respective chip connection wirings 40, corresponding to the semiconductor chips 62 via branching paths 64 (64a-64h).
More Like This:
| JP2006064667 | SEMICONDUCTOR INSPECTION DEVICE |
| WO/2004/036495 | TRANSPONDER AND TOOL FOR READING AND/OR WRITING DATA IN SAID TRANSPONDER |
Inventors:
KOMIYAMA TADASHI
Application Number:
JP2001317143A
Publication Date:
April 23, 2003
Filing Date:
October 15, 2001
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
G01R31/316; H01L21/822; H01L27/04; G01R31/28; (IPC1-7): G01R31/28; G01R31/316; H01L21/822; H01L27/04
Attorney, Agent or Firm:
Masayanagi Ueyanagi (2 outside)