Title:
チップ状電子部品用ジグ
Document Type and Number:
Japanese Patent JP7226579
Kind Code:
B2
Abstract:
[Problem] To provide a chip-shaped electronic component jig which has good ventilation and ensures ventilation when stacked in a plurality of stages. [Solution] The jig comprises a plurality of X-direction linear members X1 to X5 extending in the X-direction and a plurality of Y-direction linear members Y1 to Y6 extending in the Y-direction, wherein the X-direction linear members and the Y-direction linear members configure a plurality of chip storing portions 13. The chip storing portions 13 have first openings 16 for receiving chip-shaped electronic components 12. Ventilating pockets 17 having second openings 18 in which the chip-shaped electronic components 12 cannot be received are provided between adjacent chip storing portions 13. The ventilating pockets 17 provide ventilation with respect to the chip storing portions 13.
More Like This:
Inventors:
Yuta Tanaka
Yukihiro Nakatani
Yukihiro Nakatani
Application Number:
JP2021552362A
Publication Date:
February 21, 2023
Filing Date:
October 09, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G13/00
Domestic Patent References:
| JP2008177188A | ||||
| JP2018193287A | ||||
| JP200377776A | ||||
| JP2012144433A | ||||
| JP2006310763A | ||||
| JP202189920A |
Attorney, Agent or Firm:
Masaaki Koshiba
Previous Patent: Semiconductor device and its manufacturing method
Next Patent: Semiconductor device and its manufacturing method
Next Patent: Semiconductor device and its manufacturing method