PURPOSE: To prevent water from immersing from the side edges of leads by providing lateral projection from the side edge and recesses corresponding to adjacent lead on the inner leads of predetermined inside region from the profile end of a resin enclosure.

CONSTITUTION: Lateral projections 25a, 27a, 8b, 9b, 10b, 11c, 12c, 13c and lateral recesses 14a, 15a, 16a, 17b, 18b, 19b, 20c, 21c, 22c are formed from the side edges on inner leads 4aW4c of the inside portion (broken line 7) of a resin enclosure. The recesses and the projections are formed in rectangular shape. According to this configuration, water immersing route of the side edges of the leads 4a, 4b, 4c increases in length to suppress the immersion of the wafer.