Title:
METHOD FOR RECYCLING SCRAP SILICON
Document Type and Number:
Japanese Patent JP2005343780
Kind Code:
A
Abstract:
To make it possible to perform recycling of scrap silicon generated accompanied by the production of silicon products such as silicon wafers as business.
Only scrap silicon, which is profitable in consideration of the purchase price and the refining cost of the scrap silicon, the anticipated sales price of silicon products, or the like, is selectively recovered, and silicon capable of being sold as a silicon material is produced by refining the recovered scrap silicon.
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Inventors:
YAMAUCHI NORICHIKA
SHIMADA KATSUHIKO
SHIMADA KATSUHIKO
Application Number:
JP2004194723A
Publication Date:
December 15, 2005
Filing Date:
June 03, 2004
Export Citation:
Assignee:
IIS MATERIALS KK
International Classes:
B09B3/00; C01B33/037; B09B5/00; (IPC1-7): C01B33/037; B09B3/00; B09B5/00
Domestic Patent References:
JPH11116229A | 1999-04-27 | |||
JPH10182134A | 1998-07-07 | |||
JP2001261323A | 2001-09-26 | |||
JP2000007318A | 2000-01-11 | |||
JPH10182132A | 1998-07-07 | |||
JPH07315827A | 1995-12-05 |
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