FORMATION METHOD OF SEALING BODY

Title:

FORMATION METHOD OF SEALING BODY

Document Type and Number:

Japanese Patent JPH0595014

Kind Code:

A

Abstract:

PURPOSE: To enhance the yield of a semiconductor device which is sealed with a sealing body in the formation method of the sealing body.

CONSTITUTION: In the formation method of a sealing body, a resin film 1 to which a semiconductor pellet 3 has been fixed and bonded by means of leads 2 is held by an upper mold 5 and a lower mold 6 which constitute a cavity 4, a resin 10 is injected into the cavity 4 and the sealing body which seals one part of the resin are sealed film 1 and the semiconductor pellet 3 are sealed. In the formation method, the rear surface of the semiconductor pellet 3 is supported by a support pin 8 which is movable so as to correspond to the pressure of the resin 10. Consequently, even when the pressure of the resin 10 is exerted on the semiconductor pellet 3 and the resin film 1, it is possible to prevent the resin film 1 form being deformed because the semiconductor pellet 3 is supported by the support pin 8.

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Inventors:

YASUHARA TOSHIHIRO
NISHI KUNIHIKO
KOIZUMI KOJI

Application Number:

JP25532591A

Publication Date:

April 16, 1993

Filing Date:

October 02, 1991

Export Citation:

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Assignee:

HITACHI LTD

International Classes:

H01L21/56; B29C33/12; B29C45/02; B29C45/14; B29C45/26; B29L31/34; (IPC1-7): H01L21/56

Attorney, Agent or Firm:

Akita Aki

Next Patent: MOLD STRUCTURE