FLEXIBLE MONOLITHIC INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

Title:

FLEXIBLE MONOLITHIC INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

Document Type and Number:

Japanese Patent JP2003069034

Kind Code:

A

Abstract:

To provide a flexible integrated circuit that has improved junction characteristics and can be set to an arbitrary size simply, inexpensively, and substantially.

The flexible monolithic integrated circuit is composed of substantially flexible circuit elements, the connection elements between the flexible circuit elements, and flexible coating including at least one layer of a layer material made of polymer. Further, the circuit suits as a small and convenient integrated circuit for an electronic device that is provided on a flexible data carrier for tracking objects and persons strategically. Further, a method for manufacturing the flexible monolithic integrated circuit is also provided.

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Inventors:

FOCK JOHANN-HEINRICH
SCHNITT WOLFGANG
POHLMANN HAUKE
GAKIS ANDREAS
BURNUS MICHAEL
SCHAEFER MARTIN
MAAS HENRICUS GODEFRIDUS RAFAE
MICHIELSEN THEODORUS MARTINUS
DEKKER RONALD

Application Number:

JP2002133058A

Publication Date:

March 07, 2003

Filing Date:

May 08, 2002

Export Citation:

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Assignee:

KONINKL PHILIPS ELECTRONICS NV

International Classes:

H01L21/822; H01L21/56; H01L23/498; H01L23/538; H01L27/04; H01L27/12; H01L29/786; (IPC1-7): H01L29/786; H01L21/56; H01L21/822; H01L27/04; H01L27/12

Attorney, Agent or Firm:

Kenji Yoshitake (4 others)

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