Title:
PACKAGE
Document Type and Number:
Japanese Patent JP3714979
Kind Code:
B2
Abstract:
PURPOSE: To provide the title package having excellent electrical characteristics and the package capacity on a mother board in addition to the low cost.
CONSTITUTION: The title package 100 mounting an electronic part 50 with one surface sealed with a mold resin 60 is composed of a conductor circuit 40 formed on one surface of a flexible base material 20 formed of a through hole 30 in the state of sealing the through hole 30 as well as a conductive connecting parts 70 protruding from the other surface of the base material 20 in continuity with the conductor circuit 40 by the through hole 30. Besides, in the base material 20, the Young's modulus at the curing temperature of a molding resin does not exceed 2800kgf/mm2 while the thickness of the material thereof is 0.05-0.15mm. Furthermore, the diameter of the through hole 30 is made larger on the conductive connecting part 70 side than that on the conductor circuit 40 side.
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Inventors:
Akihiro Demura
Application Number:
JP23838494A
Publication Date:
November 09, 2005
Filing Date:
September 05, 1994
Export Citation:
Assignee:
IBIDEN CO.,LTD.
International Classes:
H01L23/28; H01L23/10; H01L23/12; H05K1/02; (IPC1-7): H01L23/28
Domestic Patent References:
| JP4277636A | ||||
| JP5263672A |
Other References:
「最新 プリント配線板技術」、電子材料編集部編、株式会社工業調査会、1985年1月10日発行、p.52-57
「実用プラスチック用語辞典」、大阪市立工業研究所プラスチック課編、(株)プラスチックス・エージ、1989年9月10日発行、p.707-708
「実用プラスチック用語辞典」、大阪市立工業研究所プラスチック課編、(株)プラスチックス・エージ、1989年9月10日発行、p.707-708
Attorney, Agent or Firm:
Yoshiyasu Takahashi
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