To provide the photosensitive resin composition enhanced in adhesion to an alloy and prevented from permeation of an etching solution and the photo sensitive film suitable for metal processing.
This photosensitive resin composition contains (A) a copolymer of (meth)acrylate and methacrylic acid and a vinyl monomer for giving a film forming property, (B) a photopolymerization initiator, (C) a photopolymerizable compound represented by formula I, and (D) a compound represented by formula II, and in formulae I and II, each of R1 and R2 is an H atom or a methyl group; R3 is 1-12C alkylene or 4-6C cycloalkylane group; R4 is a 1-6C alkylene group; each of (n) and (m) is an integer of 1-15; each of R4-6 is an optionally substituted alkylene group or the like; each of R7-R9 is a residue obtained by reaction of a compound having an isocryanate group with a compound having an active hydrogen. The photosensitive film is obtd. by forming this composition layer on a support.
ISHIKAWA TSUTOMU
TAKANO SHINJI
