To obtain a heat-resistant polymer film having excellent electric properties and mechanical properties and a copper-clad laminate film having strong bond strength, slight warpage and curl, excellent migration resistance properties and high flexibility.
The polyimidebenzoxazole film is obtained by mixing a polyamic acid prepared by reacting an aromatic diamine having a benzoxazole structure with an aromatic tetracarboxylic acid anhydride with a polyamic acid prepared from a diamine having a diphenyl ether structure and an aromatic tetracarboxylic acid anhydride in a specific composition ratio with stirring for a fixed time and forming the mixture into a film by a film casting method. Then the obtained film is provided with a substrate metal layer and a conductive metal layer by sputtering and further thickened by electroplating to give the copper-clad laminate film.
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IMAHASHI SATOSHI
WAKUI HIROYUKI
KAWAHARA KEIZO
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